Complex PCBAs
Design and development of complex printed circuit board assemblies that push technological boundaries from flex-rigid designs enabling space optimization and 3D integration to high-temperature ceramic PCBAs for demanding environments. Combined with advanced interconnection technologies and precision assembly, Neways delivers high-performance solutions for semiconductor, defense and other mission-critical applications.
High-density PCBAs
Neways specializes in assembling high-density PCBAs with a large number of components, complex layouts and multi-layer designs. Our capabilities include fine-pitch placement, mixed-technology assemblies and high-current, power-dense solutions. Designed to perform in extreme environments, these PCBAs are validated for thermal, mechanical and environmental stress ensuring reliability in applications where performance and precision are critical.
Flex-rigid PCBAs
Flex-rigid PCBAs combine the structural stability of rigid boards with the flexibility of flex circuits, enabling compact and space-efficient designs. Neways supports complex 3D layouts and lightweight solutions, optimized for applications with high mechanical stress or limited space. Our expertise includes tailored tooling, handling and assembly processes to ensure reliability throughout manufacturing and operation.
Ceramic PCBAs
Neways develops ceramic PCBAs using additive thick-film technologies on ceramic substrates, enabling superior thermal, mechanical and electrical performance. Compared to standard PCB materials, ceramics offer excellent heat dissipation, low moisture absorption and minimal outgassing, making them ideal for vacuum and high-temperature environments.
With over 30 years of experience, we combine in-house manufacturing and deep material expertise to deliver highly stable, high-precision solutions for demanding applications, where performance and reliability outweigh component-level cost considerations.
Precision assembly & interconnection technologies
We integrate advanced interconnection technologies such as wire bonding, flip-chip assembly and adhesive bonding to connect components with the highest precision. Neways ensures accurate alignment of components and seamless integration into functional modules. This enables the combination of electrical and mechanical interfaces, supporting complex system architectures and high-performance applications.
Thermal management & reliability engineering
Thermal performance and environmental protection are critical in complex PCBAs. Neways applies advanced solutions for heat dissipation, potting, sealing and coating to protect assemblies against external influences. By controlling thermal behavior and environmental exposure, we ensure long-term reliability and stable performance, even in the most demanding operating conditions.
How can we help your business?
Developing complex PCBAs requires precision, reliability and manufacturing expertise. Our specialists are ready to support you from design and industrialization to scalable production.
