Our unique capabilities

Microelectronics assembly and packaging

Neways specializes in the precision assembly, interconnection, and packaging of bare dies, leveraging our advanced assembly and packaging capabilities in our high-grade cleanroom facilities.

We provide innovative solutions for the efficient co-development and industrialization of highly complex microelectronics for sensing, Micro Electro Mechanical System (MEMS) and optoelectronic applications. Our cutting-edge expertise in miniaturization, chip-on-board bonding and material performance ensures end products of the highest quality.

Microsystem development and assembly

We are a proven design and engineering partner in the industrialization and miniaturization of microelectronics. From idea to prototype to production, our engineers bring expertise to each phase of microsystem development, resulting in optimized product performance and time to market. In our high-grade cleanrooms (ISO 6, 7 and 8) we have industry-leading processes for accurate component placement and bonding of materials, with specialized expertise in interconnection techniques such as die and wire bonding, flip chip, and Surface Mount Technology (SMT).

Customized sensor packaging

We specialize in high-end microchip packaging, module design and manufacturing solutions for smart sensors. We provide in-house knowledge and tooling for the precise positioning of microchips and mechanical, electrical and/or optical components that have narrow tolerances. We provide services for the entire process chain, from wafer grinding and dicing to molding and forming of standard and custom package types on both substrates and lead frames.

Specials

Our highly complex products are designed and assembled to ensure reliable performance in harsh environments, including space (e.g. satellites) and vacuum applications in the semiconductor industry. For these specialty products, we use advanced materials with superior thermomechanical and vacuum/outgassing characteristics, such as ceramic-based circuit boards that we produce in-house.

Our unique capabilities

Assembly and interconnectivity

We specialize in interconnection techniques such as die and wire bonding and optical placement. These in-house developed capabilities are applied across a wide range of assembly and interconnection solutions, including Surface Mount Technology (SMT), Chip-on-Board (CoB), and hybrid circuit boards. Our entire assembly and packaging process is executed in our high-grade cleanrooms, by highly skilled engineering teams with exceptional alignment accuracy.
Applied material expertise

To guarantee the optimal performance and lifespan of our microelectronic solutions, we apply our industry-leading expertise in material knowledge in the development and manufacturing of products where extreme accuracy, optical or thermal performance and cleanliness is vital. We are an adhesive bonding specialist for our customers, empowering them to introduce the most robust and reliable products on the market.
Feasibility studies and testing

Neways is your innovative design and engineering partner for microelectronic solutions and we offer several feasibility studies and testing throughout the life cycle of microsystems. Our feasibility and concept studies lead to swift analysis of process capability, production concept development and prototyping. We have extensive in-house failure testing and analysis facilities, including climate testing, X-ray, 3D microscopy, optical profilometry, and cross-sectioning. Additionally, we offer electrical testing and qualification services on location.