Microelectronics assembly and packaging

We are a proven design and engineering partner in the industrialization and miniaturization of microelectronics. From idea to prototype to production, our engineers bring expertise to each phase of microsystem development, resulting in optimized product performance and time to market. In our high-grade cleanrooms (ISO 6, 7 and 8) we have industry-leading processes for accurate component placement and bonding of materials, with specialized expertise in interconnection techniques such as die and wire bonding, flip chip, and Surface Mount Technology (SMT).

We specialize in high-end microchip packaging, module design and manufacturing solutions for smart sensors. We provide in-house knowledge and tooling for the precise positioning of microchips and mechanical, electrical and/or optical components that have narrow tolerances. We provide services for the entire process chain, from wafer grinding and dicing to molding and forming of standard and custom package types on both substrates and lead frames.

Our highly complex products are designed and assembled to ensure reliable performance in harsh environments, including space (e.g. satellites) and vacuum applications in the semiconductor industry. For these specialty products, we use advanced materials with superior thermomechanical and vacuum/outgassing characteristics, such as ceramic-based circuit boards that we produce in-house.